US PSES Agenda

US PSES will feature two days full of events, including keynotes, business meetings, networking roundtables and a gala dinner.

Speakers

Event

Venue

Tickets

May 23

May 24

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Industry Topics

Advanced Packaging

Artificial Intelligence

Memory Manufacturing

5G Networking

Supply Chain

Automotive Electronics

Event Type

Keynote

Panel

Networking

Buffet Lunch

Dinner

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07:30 - 08:50

Registration

09:00 - 09:10

Introduction

ISES Opening Address

09:15 - 09:45

Keynote

WBG power semiconductors driving e-mobility range and efficiency

Edoardo Merli

STMicroelectronics

EVP Power Transistor Sub-Group Automotive and Discrete Group

09:50 - 10:20

Keynote

Power semiconductor devices: An Overview

Alex Huang

UT Austin

Dula D. Cockrell Centennial Chair in Engineering and Director, Semiconductor Power Electronics Center

10:25 - 11:25

Networking & Coffee Break

11:30 - 12:00

Speaker

Switching and Packaging technology Innovations to deliver next generations high performance power modules

Asif Jakwani

onsemi

SVP & GM Advanced Power Division

12:05 - 12:25

Speaker

Enphase Energy’s GaN Adoption Strategy

Michael Harrison

Enphase Energy

Power Electronics Architect

12:30 - 12:50

Speaker

Gan power IC: a new platform for sustainable power conversion finds applications from consumer to EV systems.

Marco Giandalia

Navitas Semiconductor

VP IC Design

12:55 - 14:10

Buffet Lunch

14:15 – 14:35

Speaker

Roadblocks to GaN Adoption in Power Systems

Alex Lidow

EPC

CEO

14:40 – 15:00

Speaker

GaN Technology Requirements: Serving the Broadest Medium Voltage Market with the Highest Reliability and Lowest Cost

Umesh Mishra

Transphorm

CTO & Co-Founder

15:05 – 15:25

Speaker

GaN Power Semiconductors Solving Today’s Global Power Challenges

Paul Wiener

GaN Systems

VP Strategic Marketing

15:30 - 16:30

Networking & Coffee Break

16:35 – 16:45

Speaker

Testing challenges for latest SiC and GaN devices

Luca Fanelli

SPEA

Semiconductor Sales - Business Development

16:50 – 17:10

Speaker

Evaluation of the Efficiency and Performance Benefits of Wide Bandgap Switches in AC to DC Power Supplies

Doug Bailey

Power Integrations

VP Marketing & Applications Engineering

17:15 – 17:25

Closing Remarks

17:30 – Late

Gala Dinner

08:15 - 08:50

Registration

09:00 - 09:20

Speaker

Keynote

SiC Unleashed: Adopt SiC With Ease, Speed and Confidence

Dr. Avinash Kashyap

Microchip Technology

Director SiC Technology & Development and Head of R&D, Power Discretes

09:25 – 09:45

Speaker

Electrification and Innovation - The Opportunity for Solid-State Circuit Breakers

Michael Harris

Atom Power

Chief Technology Officer

9:50 – 10:20

Panel Discussion

Speaker

Innovations in Wide Band Gap Technologies and Manufacturing Challenges

Dr. Yi Zheng (Moderator)

Applied Materials

Director, ICAPS Division

Gopal Prabhu (Moderator)

Applied Materials

Senior Director of Technology Programs in the ICAPS Business Unit

Asif Jakwani

onsemi

SVP & GM Advanced Power Division

Edoardo Merli

STMicroelectronics

EVP Power Transistor Sub-Group Automotive and Discrete Group

Marco Giandalia

Navitas Semiconductor

VP IC Design

10:25 - 11:25

Networking & Coffee Break

11:30 – 11:50

Speaker

Wide Bandgap (WBG) Power Electronics Systems for Heavy-Duty Off-Road Vehicles

Brij Singh

John Deere

Technical Fellow, Region 4 Manager External Relationships

11:55 - 12:15

Speaker

An OSAT Perspective of the Power Semiconductor Market

Shaun Bowers

Amkor Technology, Inc.

VP, Power Products

12:20 – 12:25

Speaker

Metrology and Inspection Solutions for the Evolving Power Semiconductor Market

Mike Rosa

Onto Innovation

Chief Marketing Officer & SVP of Strategy

12:30 – 12:40

Speaker

Cost efficient and sustainable power semiconductor manufacturing by using BATCHSPRAY® technology.

Fabio Wörndl

Siconnex

Global Director of Sales & Marketing

12:45 – 14:00

Buffet Lunch

14:05 – 14:25

Speaker

WBG power semiconductors market trends

Jerome Azemar

Yole Developpment

Project Development Director

14:30 – 14:50

Speaker

SmartSiC technology for faster, better, and greener SiC power devices

Christophe Maleville

Soitec

CTO, Senior EVP Innovation

14:55 – 15:15

Speaker

Silicon Carbide material scalability: Rapid capacity expansion and new technology development in the era of the global unsecure supply chain

Jianwei Dong

SK Siltron CSS

CEO

15:20 – 16:20

Networking & Coffee Break

16:25 – 16:45

Speaker

Silicon Carbide, Driving the Electric Revolution

Amr Darwish

MaxPower Semiconductor, Inc

COO

16:50 – 17:10

Speaker

Power-over-Fiber for Power Electronics

Martin Weigert

Broadcom

VP & GM Industrial Fiber Product Division

17:15 – 17:35

Speaker

Power WBG Semiconductor Technology Commercialization

Victor Veliadis

PowerAmerica

Executive Director and CTO