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ISES Power EU 2024
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Website Design by CibusISES EU Power 2024 Agenda
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Industry Topics
Advanced Packaging
Artificial Intelligence
Memory Manufacturing
5G Networking
Supply Chain
Automotive Electronics
Event Type
Keynote
Panel
Networking
Buffet Lunch
Dinner
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07:30 – 08:15
Registration
08:15 – 08:25
08:30 – 08:50
Speaker
SiC and GaN in future Volkswagen Group applications
08:55 – 09:15
Speaker
EV market trends and the status-quo of automotive power semiconductors
09:20 – 09:40
Speaker
Wide-bandgap solutions enabling new possibilities in automotive and industrial market
09:45 – 10:45
Networking Break, Coffee & Business Meetings
Networking Break, Coffee & Business Meetings
10:50 – 11:10
Speaker
A foundry perspective on Wide Bandgap semiconductors
11:15 – 11:35
Speaker
Metrology and Inspection Solutions for SiC and GaN Power Devices
11:40 – 12:00
12:05 – 12:25
Speaker
800 V enabler for GaN and the solution to many EDU challenges: 3 Level inverter
12:30 – 13:45
Lunch
Lunch
13:50 – 14:10
Speaker
Transforming The Power World: The Wide-Bandgap Conversion
14:15 – 14:35
Speaker
Advanced packaging essential for full utilization of SiC semiconductors
14:40 – 15:00
Speaker
Powering the SIC Revolution with Vertical Integration
15:05 – 15:25
15:30 – 16:30
Networking Break, Coffee & Business Meetings
Networking Break, Coffee & Business Meetings
16:35 – 16:45
Speaker
Enabling Solutions for GaN Power Device Fabrication
16:50 – 17:10
Speaker
Considerations in Producing Reliable Known Good Die (KGD) from Wide-Bandgap Wafers
17:15 – 17:25
Speaker
Navigating Public Funding Opportunities for Europe's Semiconductor Industry
17:30 – 18:10
Panel Session
How is the Ecosystem Managing EV Market Beyond China?
18:15 – 20:00
Cocktail Reception
Cocktail Reception
20:00 – Late
07:55 – 08:25
Registration
08:30 – 08:50
08:55 – 09:15
Speaker
Raw material impact on the transition to 200mm SiC device production
09:20 – 09:40
Speakers: Joint Venture Presentation
How do we plan to rock the challenges in E-Mobility transformation?-A first of its kind joint venture undertaking
09:45 – 09:55
Speaker
SiC wafer dicing with multi-beam laser: optimal process quality and minimized cost
10:00 – 11:00
Networking Break, Coffee & Business Meetings
Networking Break, Coffee & Business Meetings
11:05 – 11:50
11:55 – 12:15
Speaker
Power Electronics market expansion
12:20 – 13:35
Lunch
Lunch
13:40 – 14:30
Panel Session
Is Europe ready to lead the GaN revolution?
14:35 – 14:55
Speaker
Introducing Silicon Interposers for Power Applications
15:00 – 15:30
Networking Break, Coffee & Business Meetings
Networking Break, Coffee & Business Meetings
15:35 – 15:55
Speaker
Isolation – A Package requirement
16:00 – 16:20
Speaker
GaN-on-Si technology for efficient RF front-ends
