Dr. Yi

Zheng

Applied Materials

Director, ICAPS Division

Dr. Yi Zheng is a Distinguished Member of Technical Staff and Director of Power Semiconductor Segment of ICAPS Division at Applied Materials where he is responsible for technology roadmap and strategy of Applied Materials’ products for power semiconductor including WBG and Si based discrete devices, power and analog ICs. Prior to Applied Materials, Dr. Zheng was the co-founder of Coolstar Technology that developed a novel high speed, low voltage LDMOS with industry leading FOM that enabled Si based wide-band high linearity RFPA technology for 2.4GHz and 5.8GHz WiFi applications. Dr. Zheng has authored over 25 peer reviewed journal papers and received 42 US and international patents. He is a recipient of Applied Materials Hall of Fame Patent Award. Dr. Yi Zheng received BS and MS in Materials Physics and Surface Science from Tsinghua University and PhD in Chemical Engineering from University of Minnesota.

Dr. Yi Zheng is a Distinguished Member of Technical Staff and Director of Power Semiconductor Segment of ICAPS Division at Applied Materials where he is responsible for technology roadmap and strategy of Applied Materials’ products for power semiconductor including WBG and Si based discrete devices, power and analog ICs. Prior to Applied Materials, Dr. Zheng was the co-founder of Coolstar Technology that developed a novel high speed, low voltage LDMOS with industry leading FOM that enabled Si based wide-band high linearity RFPA technology for 2.4GHz and 5.8GHz WiFi applications. Dr. Zheng has authored over 25 peer reviewed journal papers and received 42 US and international patents. He is a recipient of Applied Materials Hall of Fame Patent Award. Dr. Yi Zheng received BS and MS in Materials Physics and Surface Science from Tsinghua University and PhD in Chemical Engineering from University of Minnesota.

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Upcoming Events

May 24

 | 

9:50 - 10:20

9:50 - 10:20

Innovations in Wide Band Gap Technologies and Manufacturing Challenges

As WBG devices increase their market adoption, we discuss how these devices will continue to grow in the market with their evolving technology and packaging roadmaps. Additionally, we discuss the challenges of ramping into high volume production and larger wafer sizes in today’s supply chain constraints.

Applied Materials

We are the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. At Applied Materials, our innovations Make Possible® a Better Future.