David

Clark

Amkor Technology, Inc.

Vice President, Product Marketing and Business Development

David joined Amkor in 2013 and is currently responsible for Product Marketing and strategic business development in Europe. Prior to joining Amkor, David has held various business development and engineering positions at FlipChip International (FCI), Leica Microsystems and Agilent Technologies. David has been granted 5 patents in Optoelectronics and Device Packaging and holds a BEng Honors Degree in Electronic, Electrical and Optoelectronic Engineering from University of Glasgow.

David joined Amkor in 2013 and is currently responsible for Product Marketing and strategic business development in Europe. Prior to joining Amkor, David has held various business development and engineering positions at FlipChip International (FCI), Leica Microsystems and Agilent Technologies. David has been granted 5 patents in Optoelectronics and Device Packaging and holds a BEng Honors Degree in Electronic, Electrical and Optoelectronic Engineering from University of Glasgow.

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13:10 – 13:30

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September 20, 2022

13:10 – 13:30

An OSAT Perspective of the Power Semiconductor Market

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Amkor Technology, Inc.

As one of the world’s largest providers of high-quality semiconductor packaging and test services, Amkor has helped define and advance the technology landscape. We deliver innovative solutions and believe in partnering with our customers to bring 5G, AI, Automotive, Communications, Computing, Consumer, IoT, Industrial and Networking products to market. As a truly global supplier with a flexible supply chain, Amkor has manufacturing and test capabilities as well as product development and support offices in Asia, Europe and the US. Phone: 480-821-5000 Amkor Technology is one of the world’s largest providers of high-quality semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s broad package portfolio offers our customers semiconductor and test solutions to enable 5G, AI, Automotive, Communications, Computing, Consumer, Industrial, IoT and Networking products. Services include package design and development, wafer probe and package test, wafer bumping and redistribution, package assembly and final test. Engineering services offer best-in-class thermal, electrical and mechanical modeling and characterization as well as design automation. Test engineering services range from test program development to full product characterization of packaged RF, mixed signal, logic and memory devices. Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the US. For more information, visit www.amkor.com.