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ISES Power EU 2023
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ISES EU Power Preliminary Draft Agenda 2023
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Event Type
Keynote
Panel
Networking
Buffet Lunch
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07:30 – 08:30
Registration
08:45 - 09:00
09:05 – 09:25
09:25 – 09:45
Keynote
The European Chips Act. A Framework for Revitalizing the European Semiconductor Ecosystem
09:45 - 10:05
Speaker
Future of SiC Power Modules in Automotive and Industrial Applications
10:05 – 11:05
Networking Break and Business Meetings
Networking Break, Business Meetings and Refreshments
11:05 – 11:25
Speaker
Volkswagen Group - Power Electronics In-House Development
11:25 – 11:45
Speaker
Innovative Traction Drives with Sic Semiconductors
11:45 – 12:05
Speaker
Partnership as A Foundation for Decarbonization
12:05 – 12:25
Speaker
Business Benefits Of SmartSiC™: Unrivaled Technology For Sic In Automotive
12:25 – 12:45
Speaker
Process Control Trends for WBG Power Devices
12:45 – 14:00
Buffet Lunch
Buffet Lunch
14:00 – 14:20
Speaker
The Role of Extrinsic (Early Life) Failures and Stabilization Stress and Burn-In During the Production of Silicon Carbide and Gallium Nitride Power Semiconductors
14:20 – 15:00
Panel Session
RISK AND CHALLENGES WITH CAPACITY INVESTMENTS & SUPPLY CHAIN RESILIENCY
15:00 – 16:00
Networking Break, Business Meetings and Refreshments
Networking Break, Business Meetings and Refreshments
16:00 – 16:10
Speaker
How Laser is Enabling The Power Semiconductor Roadmap
16:10 – 16:20
Speaker
Intrinsic Reliability and Product Qualification Testing in GaN Power Semiconductors Do One the Other or Both?
16:20 – 16:30
Speaker
Addressing Testing Challenges for Power Modules and Three-Level Inverters
16:30 – 16:35
Speaker
Meeting Challenges in Power Device Fabrication with Advanced Metrology and Inspection
16:35 – 16:40
Speaker
Enabling Solutions For Advanced Power Device Fabrication
16:40 – 16:45
Speaker
Electroless Metallization as Alternative Final Finish for Power Semiconductor Devices
16:45 – 16:50
Speaker
Customized Silicon and SOI Wafers Enabling Enhanced Power Devices
16:50 – 16:55
Speaker
TEL: Moving Into the MAGIC Era of Semiconductors
16:55 – 17:00
Speaker
Thin Film Solutions for Wide Bang Gap (WBG) Power Devices
17:00 – 17:05
Speaker
Empowering Power Electronics Packaging Through Photonic Debonding
17:05 – 17:10
Speaker
The EDA breakthrough solution for SiC and GaN Front-End and Back-End
17:10 – 17:20
Speaker
SiC / IGBT Power Module Assembly & Test Equipment Solutions
17:20 – 17:30
Speaker
Total Solution of Process Kits to Enabling an Efficient Supply Chain in FAB
17:30
CLOSING ADDRESS
18:00 – 21:00
08:00 – 09:00
Registration
09:00 – 09:20
Speaker
GaN D-Mode vs. GaN E-Mode: A Clash of Technologies or The Perfect Co-Existence?
09:20 – 09:40
09:40 – 10:00
Speaker
Innoscience’s GaN Power Devices: Reliable, Price Competitive and Mass Manufactured
10:00 – 11:00
Networking Break, Business Meetings and Refreshments
11:00 – 11:20
11:20 – 11:30
MOU Announcement
I.S.E.S and GaN Valley MOU Announcement
11:30– 12:00
Panel Session
PACKAGING & INTEGRATION REQUIREMENTS AND DIFFERENT APPROACHES TO SiC AND GaN PACKAGING
12:00 - 12:20
12:20 – 13:30
Buffet Lunch
13:30 – 14:20
Panel Session
WHAT IS THE FUTURE OF SiC, GaN and IGBT IN EV?
14:20 – 15:20
Networking Break, Business Meetings and Refreshments
15:20 – 16:00
Panel Session
ECOSYSTEM COLLABORATION REQUIRED TO DRIVE UP WBG ECONOMY OF SCALE
16:30
Boat Transfer to Island
17:00
Aperitivo
17:30
Dinner
20:30
Boat Transfer Return